JPH0380349B2 - - Google Patents

Info

Publication number
JPH0380349B2
JPH0380349B2 JP7316685A JP7316685A JPH0380349B2 JP H0380349 B2 JPH0380349 B2 JP H0380349B2 JP 7316685 A JP7316685 A JP 7316685A JP 7316685 A JP7316685 A JP 7316685A JP H0380349 B2 JPH0380349 B2 JP H0380349B2
Authority
JP
Japan
Prior art keywords
seal ring
cover
seal
peripheral edge
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7316685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61231740A (ja
Inventor
Hiroshi Hirayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP7316685A priority Critical patent/JPS61231740A/ja
Publication of JPS61231740A publication Critical patent/JPS61231740A/ja
Publication of JPH0380349B2 publication Critical patent/JPH0380349B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
JP7316685A 1985-04-05 1985-04-05 ハーメチックシールカバーの製造方法 Granted JPS61231740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7316685A JPS61231740A (ja) 1985-04-05 1985-04-05 ハーメチックシールカバーの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7316685A JPS61231740A (ja) 1985-04-05 1985-04-05 ハーメチックシールカバーの製造方法

Publications (2)

Publication Number Publication Date
JPS61231740A JPS61231740A (ja) 1986-10-16
JPH0380349B2 true JPH0380349B2 (en]) 1991-12-24

Family

ID=13510300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7316685A Granted JPS61231740A (ja) 1985-04-05 1985-04-05 ハーメチックシールカバーの製造方法

Country Status (1)

Country Link
JP (1) JPS61231740A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63184356A (ja) * 1987-01-26 1988-07-29 Mitsubishi Metal Corp 半導体パツケ−ジ用窓枠状ろう材付封着板
JP4037470B2 (ja) * 1994-06-28 2008-01-23 エルピーダメモリ株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61231740A (ja) 1986-10-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees